1051 FRONTENAC ROAD, NAPERVILLE, IL 60563 • PHONE 630•416•9969 FAX: 630•416•9028
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1051 FRONTENAC ROAD, NAPERVILLE, IL 60563 • PHONE 630•416•9969 FAX: 630•416•9028 |
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Aluminum/Copper Bonded Heat Sinks
A bonded fin heat sink removes the design limiting fin extrusion ratio found in extruded heat sinks. Typical extrusion fin ratios at VEP are generally from 4:1 up to 16:1. However, VEP currently produces a bonded fin heat sink with a ratio of 44:1.Ratios higher than 44:1 are possible as well. The increase in fin ratio means more heat can be dissipated to better satisfy your thermal needs. Heat sink surface area is maximized without adding volume, thus you are able to more efficiently dissipate heat along with minimizing the amount of space a traditional aluminum heat sink may have consumed. Also, this increase can allow for lower case to junction temperatures that can increase life and reliability of a semiconductor or other electronic components. In extremely demanding thermal applications, aluminum bonded heat sinks may still not be adequate. VEP is currently making production quantities of copper bonded fin heat sinks for these applications. How does it work? Bonded fin heat sinks are fabricated by bonding custom fin stock to an extruded base with a special thermally conductive epoxy. This may be done in aluminum or copper. Bonded heat sinks are not stocked, but rather are customized for specific applications. For further information please let one of our trained staff members assist you in selecting the best product to fit your needs. Key Benefits
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